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RESIST STRIPPER
CENTURION Metal-Etch 50
CENTOX OXIDISER
PUMPS & DENSITY CONTROLLERS
MEC 5 SERIES MICROETCHES
MECetchBONDCZ-8100/CZ-2001
FLUX 2300 SERIES
OSP MECSEAL RANGE
OXFORD VUE CUPRIC CHLORIDE CONTROLLER
INSPECTION EQUIPMENT
OXFORD FERRIC CHLORIDE CONTROLLER
SOLDERMASK STRIPPER
V BOND
VISPER Inspection Equipment
AMALPHA
FLAT BOND

Solder Mask Stripper

Ristoff © C-8

C-8 has six distinct advantages over other solder mask strippers currently being marketed.

  • 100% alkaline process
  • C-8 is a double concentrate (dilute 50% with DI water)
  • ALL the solder mask is dissolved and removed within the C-8 solution. (Totally residue-free results)
  • Not required: Intermittent removal of boards to aerate polymer 
  • Not required: Secondary stage brushing to remove residues-non present 
  • Not required: Power-rinsing (conventional spray rinsing is used only to remove the working solution from p.c.b’s, NO polymer present)

C-8 removes both fully cured, aqueous liquid photo-imaging and conventional UV curable solder masks.

Dependant on type of resist, coating thickness and curing parameters, stripping times vary between 45-180 minutes. C-8 does not attack base laminates, boards are in a condition that can then be cleaned and re-coated by standard processing techniques.

Due to it’s unique additive system C-8 has an extremely long bath life. Solution loss is made good with additions of a 50% by volume mixture of C-8/DI water.

Following types of Soldermask successfully stripped

Coates Imagecure range, Probimer 77, Electra- Carapace, Taiyo-PSR Series, Tamura DSR Series, Lackwerke Peters- Elpemer