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RESIST STRIPPER
CENTURION Metal-Etch 50
CENTOX OXIDISER
PUMPS & DENSITY CONTROLLERS
MEC 5 SERIES MICROETCHES
MECetchBONDCZ-8100/CZ-2001
FLUX 2300 SERIES
OSP MECSEAL RANGE
OXFORD VUE CUPRIC CHLORIDE CONTROLLER
INSPECTION EQUIPMENT
OXFORD FERRIC CHLORIDE CONTROLLER
SOLDERMASK STRIPPER
V BOND
VISPER Inspection Equipment
AMALPHA
FLAT BOND

MECetchBOND CZ-8100 / CZ-2001

 

It is a microetching solution which produces super-roughened topography on copper surface. The unique topography helps to enhance adhesion of copper to resin.

It is widely available for processes where a high degree of adhesion is required, e.g. a pre-treatment for build-up resin lamination, dry film lamination or solder mask application

 

Click here for MEC Etch presentation